Transistors and manufacturing methods thereof

ABSTRACT

Transistors and manufacturing methods thereof are disclosed. An example transistor includes a semiconductor substrate divided into device isolation regions and a device active region. The example transistor includes a gate insulating film formed in the active region of the semiconductor substrate, a gate formed on the gate insulating film, a channel region formed in the semiconductor substrate and overlapping the gate, and LDD regions formed in the semiconductor substrate and at both sides of the gate, centering the gate. In addition, the example transistor includes source and drain regions formed under the LDD regions, offset regions formed in the semiconductor substrate and between the channel region and LDD regions, and gate spacers formed at both sidewalls of the gate.

TECHNICAL FIELD

The present disclosure relates to transistors and manufacturing methodsthereof.

BACKGROUND

Generally, a transistor includes a gate that functions as a transistorelectrode. The gate structure may be formed to include a gate insulatingfilm and a poly-silicon film and may be provided on a semiconductorsubstrate corresponding to an active region, which is defined by deviceisolation regions.

As the requirement for more highly integrated semiconductor devices hasincreased, patterns of the devices, i.e., the widths and spaces betweenword and bit lines, have become smaller. In particular, the gate channellengths are decreasing as the design rule of the gate becomes morehighly integrated.

Such short channel construction typically improves transistor responsespeed. However, because the margins for the source/drain regions formedat both sides of the gate are reduced when the channel length isshortened, a significant leakage current is generated when the gatevoltage is off. Moreover, the shortened channel characteristic and theincreased leakage current contribute to a deterioration of a thresholdvoltage characteristic and a channel current characteristic of thedevice.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view showing a transistor according to anexample embodiment.

FIGS. 2 a through 2 i are cross-sectional views that depictmanufacturing operations associated with the example embodiment of FIG.1.

FIG. 3 is a cross-sectional view showing a transistor according toanother example embodiment.

FIGS. 4 a through 4 c are cross-sectional views that depictmanufacturing operations associated with the example embodiment of FIG.3.

DETAILED DESCRIPTION

In general the example transistors and manufacturing methods describedherein may be used to minimize the leakage current that occurs as aresult of a short channel and, thus, improve the electriccharacteristics of a transistor.

One example transistor described herein includes a semiconductorsubstrate divided into device isolation regions and a device activeregion; a gate insulating film formed in the active region of thesubstrate; a gate formed on the gate insulating film; a channel regionformed in the substrate and overlapping the gate; lightly doped drain(LDD) regions formed at both sides of the channel region to center thechannel region; source and drain regions formed under the LDD regions;offset regions formed on the substrate and between the channel regionand the LDD regions; and gate spacers formed at both sidewalls of thegate. In this example transistor structure, it is preferable that theoffset regions comprise N-type impurity ions when the LDD regionscomprise P-type impurity ions and the offset regions comprise P-typeimpurity ions when the LDD regions comprise N-type impurity ions.

A second example transistor includes a semiconductor substrate dividedinto device isolation regions and a device active region; a gateinsulating film formed in the active region of the substrate; a gateformed on the gate insulating layer; LDD regions formed in the substrateand at both sides of the gate to center the gate; source and drainregions formed under the LDD regions; offset regions formed in thesubstrate and between the gate and LDD regions; and gate spacers formedat both sidewalls of the gate. In this example transistor structure, itis preferable that the offset regions comprise P-type impurity ions whenthe LDD regions comprise N-type impurity ions and the offset regionscomprise N-type impurity ions when the LDD regions comprise P-typeimpurity ions. An example process for forming the offset region includesdepositing a doped poly film on an ion-implanting buffer film andback-etching the deposited poly film. A preferable doped poly film has athickness of 100 Å to 5000 Å.

A third example transistor includes a semiconductor substrate dividedinto device isolation regions and a device active region; a gateinsulating film formed in the active region of the substrate; a gateformed on the gate insulating film; LDD regions formed on the substrateand at both sides of the gate to center the gate; offset regions formedon the substrate and between the gate and LDD regions; and gate spacersformed at both sidewalls of the gate, partially overlapping the offsetregions.

An example transistor manufacturing process described herein forms anion-implanting buffer film on an active region of a semiconductorsubstrate; forms LDD regions on the substrate by doping impurity ionsthereon; forms a photoresist pattern wider than a gate formation regionon the ion-implanting buffer film; partially removes the LDD regionsusing a mask of the photoresist film to expose the substrate; formsoffset regions at opposite sides of the LDD regions; forms a gateinsulating film on the substrate including the offset regions; forms agate on the gate insulating film; forms gate spacers at both sidewallsof the gate; and forms source and drain regions by implanting conductiveimpurity ions with a mask of the gate spacers.

In the figures discussed in greater detail below, the thickness oflayers, films, and regions are exaggerated for clarity. Also, likenumerals refer to like elements throughout. It should be understood thatwhen an element such as a layer, film, region, or substrate is referredto as being “on” another element, it can be directly on the otherelement or intervening elements may also be present.

FIG. 1 is a cross-sectional view showing an example transistor.Referring to FIG. 1, a gate insulating film 160 is formed on asemiconductor substrate 100 corresponding to a device active regiondefined by device isolation films 110. The gate insulating film 160 ismade of an oxide film and has a thickness of 50 Å to 200 Å.

A gate 170 made of poly-silicon is formed on the gate insulating film160, and gate spacers 180 are formed at both sidewalls of the gate 170.Lightly doped drain (LDD) regions 130 doped with a conductive impurityof a low concentration are formed in the substrate 100 underlying bothend portions of the gate insulating film 160 to center the gate 170.Source and drain regions 190 doped with a conductive impurity of a highconcentration are formed under the LDD regions 130.

A channel region 158 is formed under the surface of the substrate 100overlapped with the gate 170. The channel region 158 consists of asilicon film resulting from a selective epitaxial growth process.

Offset regions 155 are formed between the channel region 158 and the LDDregions 130. The offset regions 155 are doped with conductive impurityions opposite to that of the LDD regions 130, i.e., when the LDD regions130 are doped with an N-type impurity, the offset regions 155 are dopedwith a P-type impurity, and vice versa.

Because the offset regions 155, which have ions opposite to those of theLDD regions 130, are positioned between the LDD regions 130 and thechannel region 158, a leakage current generated when a gate voltage isoff by the offset regions 155 is blocked and thus a stable electriccharacteristic of the device is obtained.

FIGS. 2 a through 2 i are cross-sectional views of manufacturingoperations that may be used to manufacture the example transistor ofFIG. 2. Beginning in FIG. 2 a, an ion-implanting buffer film 120 isformed by an oxidation process of the substrate 100 where the deviceisolation films 110 are formed. Then, as shown in FIG. 2 b, LDD regionsare formed by doping N-or P-type conductive impurity ions of a lowconcentration on the substrate 100. At this time, the ion-implantingbuffer film 120 prevents the substrate 100 from being damaged during theion implantation process.

In the next operation, as shown in FIG. 2 c, a photoresist pattern (notshown) that is wider than the gate active region is formed on theion-implanting buffer film 120. Then, the ion-implanting buffer film 120and the LDD regions 130 are etched using the photoresist pattern as amask to partially expose the semiconductor substrate 100.

Next, as shown in FIG. 2 d, an impurity ion doped silicon film 150 isformed over the semiconductor layer 100 including the ion-implantingfilm 120. Here, the impurity ions of the silicon film 150 are oppositeto those of the LDD regions. That is, when the LDD regions are dopedwith N-type impurity ions, the silicon film 150 is doped with P-type,and viceoseus n lanting buffer film. A preferable final thickness of thedoped silicon film 150 is 100 Å to 500 Å.

In the next operation as shown in FIG. 2 e, the doped silicon film 150is back-etched to form offset regions 155 at opposite sidewalls of theLDD regions 130. The resultant offset regions 155 consist of the dopedsilicon film and have a spacer-like shape. Further, in this etchingoperation, the buffer films 120 are etched and removed from thesubstrate 100 with the doped silicon film 150.

Then, as shown in FIG. 2 f, the epitaxial growth process is carried outon the substrate 100 including the LDD regions 130 and the offsetregions 155 up to the upper surfaces of the offset regions 155. Asilicon grown film 158 is formed through this operation.

In the next operation as shown in FIG. 2 g, an oxidation process iscarried out on the active region of the semiconductor substrate 100including the silicon grown film 158 to form a gate insulating film 160.The resultant gate insulating film 160 consists of an oxide film.

Subsequently, as shown in FIG. 2 h, a poly-silicon film (not shown) isdeposited on the gate insulating film 160, and a selective epitaxialprocess is carried out to form a gate 170 of poly-silicon. Here, a width(CD) of the resultant gate 170 can be controlled according to thecharacteristics of fabrication and the design rules.

In the next operations as shown in FIG. 2 i, an insulating material,i.e., oxide, nitride, etc. is deposited on the entire substrate 100including the gate 170 and then back-etched to form gate spacers 180 atboth sidewalls of the gate 170. Next, as shown in FIG. 1, conductiveimpurity ions of a high concentration are implanted into the substrate100 using the gate 170 and the gate spacers 180 as a mask to form thesource and drain regions 190.

FIG. 3 is a cross-sectional view showing another example transistorhaving a structure similar to that of the example transistor of FIG. 1.Namely, a gate insulating film 160 is formed on a semiconductorsubstrate 100 corresponding to a device active region defined by deviceisolation films 110. A gate 170 is formed on the gate insulating film160, and gate spacers 180 are formed at both sidewalls of the gate 170.LDD regions 130 are formed in the substrate 100 underlying both endportions of the gate insulating film 160 to center the gate 170. Sourceand drain regions 190 are formed under the LDD regions 130.Additionally, offset regions 155 are formed between the gate 170 and theLDD regions 130. A channel region (not shown) is formed under thesurface of the semiconductor substrate 100 overlapped with the gate 170.Here, the bottom of the gate 170 is on the same layer as the bottom ofthe LDD region 130. As a result, the channel region of the gate 170 ispositioned at a lower portion than the LDD regions 130. The exampletransistor of FIG. 3 not only provides the improved electricalcharacteristics of the example transistor of FIG. 1, but also providesan elevated source and drain effect.

FIGS. 4 a through 4 c are cross-sectional views depicting exampleoperations that may be used to manufacture the example transistor ofFIG. 3. Initially, processes or operations similar to those shown inFIGS. 2 a through 2 e may be carried out. Then, as shown in FIG. 4 a, anoxidation process is carried out on the active region of the substrate100 having the LDD regions 130 and the offset regions 155 to form a gateinsulating film 170. The resultant gate insulating film 170 consists ofan oxide film.

Next, as shown in FIG. 4 b, a poly-silicon film (not shown) is depositedon the gate insulating film 160, and selective etching is carried out toform a gate 170 of polysilicon. Here, a width of the gate 170 can becontrolled according to the characteristics of the device and the designrules.

In the next operation as shown in FIG. 4 c, an insulating material,i.e., oxide, nitride, etc. is deposited on the entire substrate 100including the gate 170, and is then back-etched to form gate spacers 180at both sidewalls of the gate 170.

In the next operation as shown in FIG. 3, to form source and drainregions 190, conductive impurity ions of a high concentration areimplanted into the substrate 100 using a mask of the gate 170 and thegate spacers 180.

As mentioned above, the example transistors described herein can block aleakage current generated by a shortened gate length to meet therequirements of high-integrated devices by forming the offset regionsbetween the LDD regions and the gate or the gate channel region. As aresult, electrical stability of the device is obtained, and a shortchannel effect having a rapid response speed is also obtained.

While the examples herein have been described in detail with referenceto example embodiments, it is to be understood that the coverage of thispatent is not limited to the disclosed embodiments, but, on thecontrary, is intended to cover various modifications and equivalentarrangements included within the sprit and scope of the appended claims.

1. A transistor comprising: a semiconductor substrate divided intodevice isolation regions and a device active region; a gate insulatingfilm formed in the active region of the semiconductor substrate; a gateformed on the gate insulating film; a channel region formed in thesemiconductor substrate and overlapping the gate; LDD regions formed inthe semiconductor substrate and at both sides of the gate, centering thegate; source and drain regions formed under the LDD regions; offsetregions formed in the semiconductor substrate and between the channelregion and LDD regions; and gate spacers formed at both sidewalls of thegate.
 2. The transistor of claim 1, wherein the offset regions includeN-type impurity ions and the LDD regions include P-type impurity ions.3. The transistor of claim 1, wherein the offset regions include P-typeimpurity ions and the LDD regions include N-type impurity ions.
 4. Atransistor manufacturing process comprising: (a) forming anion-implanting buffer film on an active region of a semiconductorsubstrate; (b) forming LDD regions in the semiconductor substrate bydoping the substrate with impurity ions; (c) forming a photoresistpattern wider than a gate formation region on the ion-implanting bufferfilm; (d) removing the LDD regions partially using a mask of thephotoresist film to expose the semiconductor substrate; (e) formingoffset regions at opposite sides of the LDD regions; (f) forming achannel region on the exposed semiconductor substrate through aselective epitaxial growth process; (g) forming a gate insulating filmon the semiconductor substrate including the channel region; (h) forminga gate on the gate insulating film, overlapping the channel region; (i)forming gate spacers at both sidewalls of the gate; and j) formingsource and drain regions by implanting conductive impurity ions with amask of the gate spacers.
 5. The transistor manufacturing process ofclaim 4, wherein the offset regions are doped with P-type impurity ionswhen the LDD regions are doped with N-type impurity ions, and the offsetregions are doped with N-type impurity ions when the LDD regions aredoped with P-type impurity ions.
 6. The transistor manufacturing processof claim 4, wherein the transistor-forming operation (e) comprisesdepositing a doped poly film on an ion-implanting buffer film andback-etching the doped poly film.
 7. The transistor manufacturingprocess of claim 6, wherein the doped poly film has a thickness of 100 Åto 500 Å.
 8. A transistor comprising: a semiconductor substrate dividedinto device isolation regions and a device active region; a gateinsulating film formed in the active region of the semiconductorsubstrate; a gate formed on the gate insulating film; LDD regions formedon the semiconductor substrate and at both sides of the gate, centeringthe gate; source and drain regions formed under the LDD regions; offsetregions formed in the semiconductor substrate and between the gate andLDD regions; and gate spacers formed at both sidewalls of the gate. 9.The transistor of claim 8, wherein the offset regions include N-typeimpurity ions and the LDD regions include P-type impurity ions.
 10. Thetransistor of claim 8, wherein the offset regions include P-typeimpurity ions and the LDD regions include N-type impurity ions.
 11. Atransistor manufacturing process comprising: (a) forming anion-implanting buffer film on an active region of a semiconductorsubstrate; (b) forming LDD regions in the semiconductor substrate bydoping the substrate with impurity ions; (c) forming a photoresistpattern wider than a gate formation region on the ion-implanting bufferfilm; (d) partially removing the LDD regions using a mask of thephotoresist film to expose the semiconductor substrate; (e) formingoffset regions at opposite sides of the LDD regions; (f) forming achannel region on the exposed substrate through a selective epitaxialgrowth process; (g) forming a gate insulating film on the semiconductorsubstrate including the offset regions; (h) forming a gate on the gateinsulating film; (i) forming gate spacers at both sidewalls of the gate;and (j) forming source and drain regions by implanting conductiveimpurity ions with a mask of the gate spacers.
 12. The transistormanufacturing process of claim 11, wherein the offset regions are dopedwith P-type impurity ions when the LDD regions are doped with N-typeimpurity ions, and the offset regions are doped with N-type impurityions when the LDD regions are doped with P-type impurity ions.
 13. Thetransistor manufacturing process of claim 11, wherein the transistorforming operation (e) comprises depositing a doped poly film on anion-implanting buffer film and back-etching the doped poly film.
 14. Thetransistor manufacturing process of claim 12, wherein the doped polyfilm has a thickness of 100 Å to 500 Å.